中文简介
IEEE关于组件、封装和制造的交易涵盖了以下内容领域：建模、设计、构建模块、技术基础设施和支持电子、光子和MEMS封装的分析，以及无源组件、电气触点和连接器、热管理和设备可靠性方面的新发展；以及电子零件和总成的制造，具有广泛的设计、工厂建模、装配方法、质量、产品鲁棒性和环境设计。IEEE技术协会的会员资格提供了访问顶级出版物的机会，如作为会员利益或通过折扣订阅。该杂志的电子版是CPMT协会会员的一部分，但也提供所有媒体类型的购买。
英文简介
IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.
近年期刊自引率趋势图
JCR分区
| JCR分区等级 | JCR所属学科 | 分区 | 影响因子 |
| Q3 | ENGINEERING, ELECTRICAL & ELECTRONIC | Q3 | 1.922 |
| ENGINEERING, MANUFACTURING | Q4 | ||
| MATERIALS SCIENCE, MULTIDISCIPLINARY | Q4 |
近年期刊影响因子趋势图
CiteScore数值
| CiteScore | SJR | SNIP | 学科类别 | 分区 | 排名 | 百分位 |
| 4.10 | 0.623 | 1.032 | 大类：Engineering 小类：Industrial and Manufacturing Engineering | Q2 | 109 / 338 |
67% |
| 大类：Engineering 小类：Electrical and Electronic Engineering | Q2 | 254 / 708 |
64% |
|||
| 大类：Engineering 小类：Electronic, Optical and Magnetic Materials | Q2 | 106 / 259 |
59% |
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