IEEE Computer Architecture Letters

所属栏目:SCI期刊 热度:176

  中文简介

IEEE计算机体系结构是一个严格经过同行评审的论坛,用于发布在单处理器和多处理器计算机系统、计算机体系结构、微体系结构、工作负载特性、性能评估和仿真技术以及功耗感知计算等领域的早期、高影响的结果。欢迎提交任何有关电脑架构的专题,特别是但不限于:微处理器和多处理器系统、微体系结构和ILP处理器、工作负载特性、性能评估和仿真技术、编译器-硬件和操作系统-硬件交互、互连体系结构、内存和缓存系统、体系结构级别的电源和热问题、I/O体系结构和技术、对以前发布的结果的独立验证、不成功技术的分析、特定于领域的处理器体系结构(例如,嵌入式、图形、网络等)、实时和高可用性体系结构、可重构系统。LCA是一个半年度论坛,以简短的、批判性参考的技术论文的形式快速发布新的、高质量的想法。我们将继续接受投稿,并将立即在IEEE数字图书馆和下一期印刷版上发表已被接受的信件。计算机体系结构技术委员会的成员将因成为成员而受益于印刷版。作者应通过学术论文投稿。

  英文简介

IEEE Computer Architecture Letters is a rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessor computer systems, computer architecture, microarchitecture, workload characterization, performance evaluation and simulation techniques, and power-aware computing. Submissions are welcomed on any topic in computer architecture, especially but not limited to: microprocessor and multiprocessor systems, microarchitecture and ILP processors, workload characterization, performance evaluation and simulation techniques, compiler-hardware and operating system-hardware interactions, interconnect architectures, memory and cache systems, power and thermal issues at the architecture level, I/O architectures and techniques, independent validation of previously published results, analysis of unsuccessful techniques, domain-specific processor architectures (e.g., embedded, graphics, network, etc.), real-time and high-availability architectures, reconfigurable systems.LCA is a semi-annual forum for fast publication of new, high-quality ideas in the form of short, critically refereed, technical papers. Submissions are accepted on a continuing basis, and accepted letters will be published immediately in the IEEE Digital Library and in the next available print issue. Members of the Technical Committee on Computer Architecture will receive the print issue as a benefit of being a member. Authors should submit their manuscript through ScholarOne Manuscripts.

  近年期刊自引率趋势图

  JCR分区

JCR分区等级 JCR所属学科 分区 影响因子
Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Q3 2.118

  近年期刊影响因子趋势图

  CiteScore数值

CiteScore SJR SNIP 学科类别 分区 排名 百分位
4.40 0.716 0.908 大类:Computer Science 小类:Hardware and Architecture Q2 65 / 167

61%

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