PLASMA CHEMISTRY AND PLASMA PROCESSING

PLASMA CHEMISTRY AND PLASMA PROCESSING

等离子体化学和等离子体处理

期刊周期:Quarterly
研究方向:工程技术
影响因子:2.768
通讯地址:SPRINGER, 233 SPRING ST, NEW YORK, USA, NY, 10013
官网:http://www.springer.com/physics/classical+continuum+physics/journal/11090
投稿地址:http://mc.manuscriptcentral.com/pcpp
审稿速度:较慢,6-12周

  中文简介

《等离子体化学与等离子体处理》是一份国际期刊,为发表有关等离子体化学与等离子体处理的基础研究和新进展的原始论文提供了一个论坛。该杂志涵盖了所有类型的工业加工等离子体,从非热等离子体到热等离子体,并出版了基础等离子体研究以及特定等离子体应用的研究。感兴趣的应用领域包括微电子和其他领域的等离子体蚀刻、薄膜和涂层的沉积、粉末合成、环境处理、照明、表面改性等。包括等离子体的化学动力学研究,以及等离子体与表面的相互作用。

  英文简介

Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.

  近年期刊自引率趋势图

  JCR分区

JCR分区等级 JCR所属学科 分区 影响因子
Q2 PHYSICS, FLUIDS & PLASMAS Q2 3.337
PHYSICS, APPLIED Q2
ENGINEERING, CHEMICAL Q2

  近年期刊影响因子趋势图

  CiteScore数值

CiteScore SJR SNIP 学科类别 分区 排名 百分位
5.40 0.549 1.120 大类:Materials Science 小类:Surfaces, Coatings and Films Q1 30 / 129

77%

大类:Materials Science 小类:General Chemical Engineering Q1 70 / 280

75%

大类:Materials Science 小类:Condensed Matter Physics Q2 106 / 415

74%

大类:Materials Science 小类:General Chemistry Q2 110 / 409

73%

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