SENSORS AND ACTUATORS A-PHYSICAL

　　中文简介

传感器和执行器A-物理将多学科的兴趣集中在一本杂志上，该杂志专门传播关于固态传感器研究和开发的各个方面的信息。传感器和执行器A：物理部定期向编辑发布原始论文、信件，并在以下设备区域不时邀请评论文章：?基础和物理，如：效应分类、物理效应、测量理论、传感器建模、测量标准、测量误差、单位和常数、时间和频率测量。建模论文应该把新的建模技术带到这个领域，并得到实验结果的支持。?材料及其加工，如：压电材料、聚合物、金属氧化物、III-V和II-VI半导体、厚膜和薄膜、光学玻璃纤维、非晶、多晶和单晶硅。?光电传感器，例如：光伏二极管、光电导体、光电二极管、光电晶体管、正电子敏感光电探测器、光电隔离器、光电二极管阵列、电荷耦合器件、发光二极管、注入激光器和液晶显示器。?机械传感器，例如：金属、薄膜和半导体应变计、扩散硅压力传感器、硅加速度计、固态位移传感器、压电连接装置、压电场效应传感器（PIFET）、隧道二极管应变传感器、表面声波装置、硅微机械开关，固态流量计和电子流量控制器。?热传感器，例如：铂电阻、热敏电阻、二极管温度传感器、硅晶体管温度计、集成温度传感器、PTAT电路、热电偶、热电堆、热电温度计、石英温度计、功率晶体管和厚膜热打印头。?磁传感器，例如：磁电阻、Corbino磁盘、磁二极管、霍尔效应设备、集成霍尔设备、硅耗尽层磁强计、磁注入晶体管、放大镜、横向磁晶体管、载流子域磁强计、MOS磁场传感器、固态读写磁头。?微观机械，例如：关于执行器、结构、集成传感器执行器、微系统以及尺寸从毫米到亚微米的其他设备或子设备的研究论文；微观机电一体化；微电子机械系统；微光机械系统；微机械系统；微机器人；硅和非硅织物操作技术；对微机械感兴趣的物理现象的基础研究；微系统分析；与微机械相关的新课题和材料的探索；与微系统相关的问题，如电源和信号传输、与微系统相关的模拟工具；其他微机械感兴趣的课题。?接口电子：设计用于直接与上述传感器接口的电子电路，用于改善或补充这些设备的特性，如线性化、A/D转换、温度补偿、光强补偿、电流/频率转换和微机集成。表面处理。?传感器系统和应用，例如：传感器总线、多传感器系统、传感器网络、投票系统、遥测、传感器阵列以及汽车、环境、监测和控制、消费者、医疗、警报和安全、机器人、航海、航空和航天测量系统。

　　英文简介

Sensors and Actuators A-Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:? Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.? Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.? Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.? Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.? Thermal sensors, such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.? Magnetic sensors, such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.? Micromechanics, such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.? Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.? Sensor Systems and Applications, such as: sensor buses, multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security, robotic, nautical, aeronautical and space measurement systems.

　　近年期刊自引率趋势图

　　JCR分区

JCR分区等级	JCR所属学科	分区	影响因子
Q1	INSTRUMENTS & INSTRUMENTATION	Q1	4.291
	ENGINEERING, ELECTRICAL & ELECTRONIC	Q2

　　近年期刊影响因子趋势图

　　CiteScore数值

CiteScore	SJR	SNIP	学科类别	分区	排名	百分位
6.70	0.738	1.323	大类：Physics and Astronomy 小类：Instrumentation	Q1	11 / 136	92%
			大类：Physics and Astronomy 小类：Metals and Alloys	Q1	18 / 155	88%
			大类：Physics and Astronomy 小类：Surfaces, Coatings and Films	Q1	21 / 129	84%
			大类：Physics and Astronomy 小类：Condensed Matter Physics	Q1	70 / 415	83%
			大类：Physics and Astronomy 小类：Electrical and Electronic Engineering	Q1	123 / 708	82%
			大类：Physics and Astronomy 小类：Electronic, Optical and Magnetic Materials	Q1	52 / 259	80%

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